PCB Board treatment principle: a layer of organic film is formed on the copper surface of the Communication PCB to protect the surface of fresh copper and prevent oxidation and pollution at high temperature. OSP film thickness is generally controlled at 0.2-0.5 microns. Feature is it has smooth surface, no IMC is formed between OSP film and circuit board copper pads, allowing welding solder and printed circuit board copper welding. Low temperature processing technology, low cost, less energy use. It can be used in low technology PCB or high density chip packaging substrate.