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What Are the Reasons of Blister on Printed Circuit Board?

Nov 01, 2017

The surface quality problem of the Printed Circuit Board is divided into two parts: the problem of surface cleanliness and problem of surface roughness. 

1.Substrate processing problem, especially for some thinner substrate, its rigidity is poor, it is not suitable to use brush plate. This many not be able to remove protective layer effectively. 

2.Surface in machining process caused by oil or other liquid contaminated with dust pollution, poor surface treatment phenomenon.

3.Pay attention to control the brush plate process, the process parameters can be adjusted to the optimum through the grinding mark test and the water film test.

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