1.Substrate processing problems: especially for some thinner Industry PCB substrate, because the substrate is poor rigidity, it is not suitable to use brush plate. It need to pay attention to control in production and processing, so as not to cause the surface substrate, copper foil and chemical copper bonding between the poor caused by the surface blister.
2.The Power Supply PCB surface of the engine in the process of oil or other liquids contaminated with dust pollution, surface treatment bad phenomenon.
3.Sink copper brush plate is bad.
4.Washing problem: uneven defects, resulting in some binding problems. We should pay attention to strengthening the control of water washing.
5.Copper pretreatment and pattern plating pretreatment.