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What Are the Process Requirements When Making Communication PCB Test Point?

Dec 13, 2017

We all knowing the importance of the Communication PCB test point, then what are the process requirements of making it?

1.The weld plate used for welding zero device can not be used as a testing point, and a special test pad must be designed. The pad is on the same side of China Printed Circuit Board, so it is easy to detect and reduce the cost. 

2.In order to ensure reliable grounding and prolong the service life of the probe, the rest points are selected with soft, easy to run and oxidize metal.

3.The test point must be larger than 5mm from the PCB board edge. It needs to be placed outside the 1mm around the component to avoid impact of probes and components. 

4.The diameter of the test point is not less than 0.4mm, the distance between the adjacent test points is better than 2.54mm, but it should not be less than 0.27mm.

5.The test point should be evenly distributed on the PCB to reduce the probe compressive stress concentration. The power supply line on the printed circuit board should set the test breakpoints in different regions, so as to make the power supply decoupling or fault point query.

Communication PCB


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