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Why Do We Use Thermal Cycle Experiment on PCB

Jul 13, 2017

The main purpose of the thermal cycle experiment is to simulate the possible effects of thermal stress in the life cycle of electronic products, but only by means of acceleration. In this way, we can test whether the Printed Circuit Board meets the reliability requirement of the product for a long time, so as to guarantee its long-term reliability. This test will research different grades of products with different levels, and organizations such as IPC and JDEC will define specifications for such tests. This type of testing simulation method has many kinds, such as: the pressure cooker test (PCT), thermal cycling test (TCT), high stress test (HAST), and the newly developed high current stress test method (IST) is one of them.

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