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Thermal Stress Test of Printed Circuit Board

Jul 08, 2017

The thermal stress test adopted by Printed Circuit Board mainly consists of two kinds of thermal shock and thermal cycling. The main purpose of thermal shock test is to rapidly change the temperature condition when the simulation circuit board is assembled, and to detect the influence of the fast temperature change on the circuit board. Including the test technique is more common: tin (drift of the circuit board is floating in the furnace, simulation of wave soldering condition), leaching oil (also simulate the wave soldering condition, but not a lot of tin surface residues, it is easier for observation and analysis of defects, tin (SMT simulation assembly reflow conditions).

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