In printed circuit board manufacturing, may cause multilayer lamination defects, lack of glue or resin content, PCB Board with pits, resin, wrinkles, or thickness is inconsistent, here we talk about their reasons and solutions. Appearance will be white, showing the glass cloth weave. The reason is that resin flow is too high, pre-stress is high, the adhesive sheet has a low resin content, long gel time and high fluidity.
1.Lower the temperature or pressure
3.after careful observation of the resin flow conditions, temperature rise, pressure changes, adjust the application of high pressure start time.
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