Recently miniaturization development is the main reason of great momentum that electronic industry expansion. As miniaturization promote industry continuously, electronics fabricating and PCB Manufacturing is becoming high challenging. The most challenging factor of manufacturing PCB is the incorporation of high density through-holes used for interconnects. The through-holes are used for electronic components, which make up the Printed Circuit Board.
As the increase of packing density of the through-holes in PCB assemble line, the requirement of smaller holes increases respectively. Two main technologies used to produce repeatable holes and accuracy of microns in diameter are laser drilling and mechanical drilling. The range of through-hole diameters is 50-300 microns, and operation is about 1-3mm deep with these High Precision Circuit Board drilling techniques.