Maximum processing size: single and double panel: 1000mm*600mm, Multi layer PCB: 600mm*600mm.
Processing plate thickness: rigid plate: 0.4mm-4.0mm, flexible plate: 0.025mm-0.15mm.
Its process capability is as following:
Drilling: the minimum aperture is 0.15mm.
Hole metallization: min aperture: 0.15mm, plate thickness/aperture ratio: 4:1.
Wire width: gold plate of min line width is 0.075mm and tin plate is 0.10mm.
Gold-plated plate: nickel layer thickness is ≧2.5μ, gold layer thickness is 0.05-0.1μm, or made according to customer requirements.
V cut: angle is 30 degrees, 35 degrees, 45 degrees, minimum size is 80mm*80mm.
Solder resistance: 85-105℃/280℃-360℃.
Flexibility and chemical resistance of flexible circuit board is full compliance with international standards.